How to make UAV circuit board: The relationship between material, process and performance

First, the key factors of the performance of the UAV circuit board

The performance of UAV circuit board mainly includes electrical performance, mechanical performance, thermal performance and reliability. Electrical properties mainly include electrical conductivity, insulation and signal transmission efficiency; Mechanical properties are concerned with the strength, flexibility and impact resistance of the circuit board; Thermal performance relates to the heat resistance and heat dissipation of the circuit board; Reliability refers to the stable working ability of the circuit board in a long time and complex environment.

Second, the relationship between the performance of the UAV circuit board and the material.

Conductive materials: conductive materials in the circuit board, mainly copper foil, whose conductive properties directly affect the electrical performance of the circuit board. The high-quality copper foil has excellent electrical conductivity and weld-ability, which can ensure the stability and reliability of the UAV circuit board in the high-speed signal transmission and welding process.

Substrate material: The substrate material determines the mechanical and thermal properties of the board. For example, the FR-4 epoxy resin substrate has good mechanical strength and heat resistance, which is suitable for most UAV circuit boards; The aluminum-based material has better heat dissipation performance and is suitable for high-performance, high-power UAV circuit boards.

Solder mask: Solder resist inks are used to protect non-welded areas on the circuit board from contamination and damage during welding. High quality solder resistance inks have good corrosion resistance and wear resistance, which can ensure the stability and reliability of the circuit board in complex environments.

Third, the relationship between the performance of the UAV circuit board and the process

Plate making process: The accuracy and consistency of the plate making process directly affects the electrical performance of the circuit board. The high-precision plate making process can ensure the accuracy and consistency of the circuit pattern, and reduce the error and loss of signal transmission.

Etching process: The uniformity and depth control of the etching process is critical to the electrical conductivity and reliability of the board. Suitable etching process can ensure the clarity of circuit pattern and the uniformity of conductive layer, improve the performance and reliability of the circuit board.

Electroplating process: The selection and parameter setting of electroplating process have an important impact on the electrical conductivity and reliability of the circuit board. The appropriate plating process can ensure the uniformity and stability of the conductive layer and improve the electrical performance and reliability of the circuit board.

Solder resistance process: The uniformity and corrosion resistance of the solder resistance process are critical to the protective performance of the circuit board. The high quality solder stop process can ensure the uniformity and corrosion resistance of the solder stop layer, and improve the stability and reliability of the circuit board.

High-quality materials and fine processes can ensure that the circuit board has excellent electrical properties, mechanical properties, thermal properties and reliability. In the design and production process of the UAV circuit board, it is necessary to consider multiple factors such as materials, processes and performance in order to achieve optimal performance and cost effectiveness. At the same time, with the continuous development of UAV technology, the requirements for circuit board performance are also constantly improving, so it is necessary to constantly explore new materials, processes and technologies to meet the development needs of UAV technology.