PCB circuit board production process detailed!

The PCB board making process can be roughly divided into the following 12 steps, each process needs to be processed by a variety of processes, it should be noted that different structure of the board its process is different, the following process is the complete production process of multi-layer PCB;

First, the inner layer; Mainly for the production of PCB circuit board inner line; The production process is as follows:

1. Cutting board: cutting PCB substrate to production size;

2. Pre-treatment: clean PCB substrate surface and remove surface pollutants

3. Film pressing: paste the dry film on the surface of PCB substrate to prepare for the subsequent image transfer;

4. Exposure: Exposure equipment is used to expose the coated substrate with ultraviolet light, so as to transfer the image of the substrate to the dry film;

5. DE: The exposed substrate is developed, etched and removed to complete the production of the inner plate.

Second， Internal inspection; Mainly in order to detect and maintain the board line;

1. AOI: AOI optical scanning, which can compare the PCB board image with the recorded data of good quality board, so as to find the notch, sag and other adverse phenomena on the board image;

2. VRS: The bad image data detected by AOI will be sent to VRS for maintenance by relevant personnel.

3, the wire: the gold wire welding in the gap or depression, to prevent poor electrical performance;

Third, pressing; As the name suggests is a plurality of inner plate pressed into a plate;

1, brown: brown can increase the adhesion between the board and the resin, and increase the wettability of the copper surface;

2. Riveting: Cut PP into small sheets and normal size to make the inner plate fit with the corresponding PP

3, superimposed pressing, shooting, gong edge, edge grinding;

Forth, drilling; According to customer requirements, the board will be drilled with a drilling machine of different diameters and sizes, so that the holes between the board for subsequent processing plug-in, but also to help the board heat dissipation;

Fifth,Primary copper; Copper plating for the outer plate has been drilled holes, so that each layer of the board line conduction;

1, deburring line: remove the burr on the edge of the plate hole to prevent poor copper plating;

2, remove glue line: remove the glue slag inside the hole; In order to increase the adhesion during micro-etching;

3, a copper (pth) : copper plating in the hole to make each layer of the board line conduction, and increase the copper thickness;

Sixth, the outer layer; The outer layer is roughly the same as the inner layer of the first step, its purpose is to facilitate the subsequent process to make the line;

1, pre-treatment: by pickling, grinding brush and drying clean board surface to increase the adhesion of dry film;

2. Film pressing: paste the dry film on the surface of PCB substrate to prepare for the subsequent image transfer;

3, exposure: UV light irradiation, so that the dry film on the board to form polymerization and non-polymerization state;

4.Development: dissolves the dry film that did not polymerize during exposure, leaving spacing;

Seventh, secondary copper and etching; Secondary copper plating for etching;

1, two copper: electroplating pattern, for the hole is not covered with dry film on the place of chemical copper; At the same time, further increase the conductivity and copper thickness, and then through tin plating to protect the integrity of the etching line, hole;

2.SES: The bottom copper of the outer dry film (wet film) attachment area is etched through the process of film removal, etching, tin stripping, etc., and the outer circuit is thus completed.

Eighth, welding resistance: can protect the board, prevent oxidation and other phenomena;

1, pre-treatment: pickling, ultrasonic washing and other processes to remove board oxides, increase the roughness of the copper surface;

2, printing: the PCB board does not need to be welded place covered with solder resistance ink, play the role of protection and insulation;

3, pre-baking: drying solder resistance ink in the solvent, at the same time to harden the ink for exposure;

4, exposure: through UV light curing solder resistance ink, through photosensitive polymerization to form high polymer;

5, development: remove the unpolymerized ink in the sodium carbonate solution;

6, after baking: make the ink completely hardened;

9. Silkscreen; The printed word;

1, pickling: clean the surface of the board, remove surface oxidation to strengthen the adhesion of printing ink;

2, text: printing text, convenient for subsequent welding process;

Ten, surface treatment OSP; The side of the bare copper plate to be welded is coated to form a layer of organic skin film to prevent rust oxidation;

Eleven, forming; Gong out of the customer needs the board shape, convenient for customers to SMT and assembly;

Xii. Flying needle test; Test board circuit to avoid short-circuit board outflow;

13. FQC; Final inspection, complete sampling inspection after completion of all processes;

14. Packaging and delivery; The finished PCB board was vacuum-packed, packaged and delivered, and the delivery was completed.