PCB circuit board production process

1. Cut the material

Intention: According to the requirements of engineering data MI, cut the large sheet to small pieces for production. Small sheet material to meet customer requirements.

Process: large plate material → cut plate according to MI requirements → curium plate → rounded corner \ edge grinding → out plate

2. Drilling

Intention: According to engineering data, drill out the desired aperture at the corresponding position on the sheet material that meets the required size.

Process: laminated pin → upper plate → drilling → lower plate → view \ repair

3. Sinking copper

Intention: Copper deposition is the use of chemical methods on the insulation hole wall on a thin layer of copper.

Process: rough grinding → hanging plate → automatic copper sinking line → lower plate → dipping % dilute H2SO4→ thickening copper

4. Graphic handling

Intent: Graphic transfer is the transfer of pictures from production film to board

Process: (blue oil process) : grinding → printing the first side → drying → printing the second side → drying → explosion → image flushing → view; (dry film process) : hemp plate → film pressing → static → alignment → exposure → static → image flushing → view

5. Graphic plating

Intention: Graphic plating is the plating of a copper layer of required thickness and a gold nickel or tin layer of required thickness on the copper skin or hole wall exposed by the line pattern.

Process: upper plate → oil removal → water washing twice → micro-etching → water washing → pickling → copper plating → water washing → acid leaching → tin plating → water washing → lower plate

6. Remove the film

Intention: Use NaOH solution to recede the anti-plating coating to expose the non-line copper layer.

Process: water film: jack → dip alkali → wash → wipe → over the machine; Dry film: put plate → pass machine

7. Etching

Intent: Etching is the use of chemical reactions to remove the copper layer from non-line parts.

8. Green solder mask

Intention: The green oil is to transfer the green oil film graphics to the board, to maintain the line and prevent the soldering parts on the line tin effect

Process: grinding plate → printing sensitive green oil → curium plate → exposure → impact; Grinding plate → printing the first side → drying plate → printing the second side → drying plate

9. Characters

Intent: A character is a token provided for easy recognition

Process: green oil curium finally curium cooling static → screen → printing characters → curium

10. Gold-plated fingers

Intention: To coat the plug finger with a layer of nickel gold of required thickness to make it more hard and wear resistant

Process: upper plate → oil removal → water washing twice → micro-etching → water washing twice → pickling → copper plating → water washing → nickel plating → water washing → gold plating

Tin plating (a parallel process)

Intention: Tin spraying is to spray a layer of lead tin on the exposed copper surface that is not covered with solder resistance oil, in order to maintain the copper surface from corrosion and oxidation, so as to ensure good welding performance.

Process: micro erosion → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying

11. Forming

Intention: Through the mold stamping or CNC gong machine gong out of the shape of the customer needs the method of organic gong, beer plate, gong, hand cutting

Data gong machine plate and beer plate accuracy is higher, second, hand cutting plate can only do some brief shape.

12. Test

Intention: Through electronic 100% test, detect open circuit, short circuit and other defects affecting functionality that are not easily detected visually.

Process: Upper die → plate → test → qualified →FQC eye inspection → unqualified → repair → return test →OK→REJ→ scrap